Original paper
Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography
Abstract
The current progress of system miniaturization relies extensively on the development of 3D machining techniques to increase the areal structure density. In this work, a wafer-scale out-of-plane 3D silicon (Si) shaping technology is reported, which combines a multistep plasma etching process with corner lithography. The multistep plasma etching procedure results in high aspect ratio structures with stacked semicircles etched deep into the...
Paper Details
Title
Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography
Published Date
Mar 23, 2020
Volume
6
Issue
1
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Notes
History