Wafer

https://www.wikidata.org/wiki/Q267131

Field Hierarchy

Parent
Physics 33M papers	Engineering 25M papers	Materials science 18.5M papers	Electrical engineering 4.8M papers
Nanotechnology 4.1M papers		Optoelectronics 3.7M papers
Current
Wafer 127k papers
Child
Semiconductor device fabrication 8,809 papers	Wafer bonding 5,898 papers	Chip-scale package 5,320 papers	Wafer dicing 4,461 papers
Anodic bonding 4,037 papers	Through-silicon via 3,538 papers	Reticle 3,191 papers	Hybrid silicon laser 3,176 papers
Wafer fabrication 2,918 papers		Wafer-level packaging 2,912 papers

Trends

Notes

History