Wafer

https://www.wikidata.org/wiki/Q267131

Field Hierarchy

Parent
Physics 33.6M papers	Engineering 25.6M papers	Materials science 19M papers	Electrical engineering 4.9M papers
Nanotechnology 4.2M papers		Optoelectronics 3.8M papers
Current
Wafer 129k papers
Child
Semiconductor device fabrication 9,008 papers	Wafer bonding 6,023 papers	Chip-scale package 5,398 papers	Wafer dicing 4,538 papers
Anodic bonding 4,117 papers	Through-silicon via 3,600 papers	Reticle 3,244 papers	Hybrid silicon laser 3,236 papers
Wafer-level packaging 2,967 papers		Wafer fabrication 2,960 papers

Trends

Notes

History