Wafer

https://www.wikidata.org/wiki/Q267131

Field Hierarchy

Parent
Physics 31.7M papers	Engineering 23.9M papers	Materials science 18.2M papers	Electrical engineering 4.7M papers
Nanotechnology 4.2M papers		Optoelectronics 3.7M papers
Current
Wafer 127k papers
Child
Semiconductor device fabrication 8,897 papers	Wafer bonding 6,034 papers	Chip-scale package 5,206 papers	Wafer dicing 4,425 papers
Anodic bonding 4,076 papers	Through-silicon via 3,559 papers	Reticle 3,216 papers	Hybrid silicon laser 3,134 papers
Wafer fabrication 2,924 papers		Wafer-level packaging 2,878 papers

Trends

Notes

History