Characterization of Micromachined On-Wafer Probes for the 600–900 GHz Waveguide Band

Volume: 4, Issue: 4, Pages: 527 - 529
Published: Jul 1, 2014
Abstract
A micromachined on-wafer probe has been designed to facilitate the development of integrated circuits in the 600-900 GHz frequency range. The probe tip is fabricated on a 5-micrometer thick high-resistivity silicon substrate using a silicon-on- insulator fabrication process. This letter updates previous work on WR-1.2 wafer probes and presents for the first time the full RF characterization of the probe. These are the first reported on-wafer...
Paper Details
Title
Characterization of Micromachined On-Wafer Probes for the 600–900 GHz Waveguide Band
Published Date
Jul 1, 2014
Volume
4
Issue
4
Pages
527 - 529
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