Original paper
Glass Substrate With Integrated Waveguides for Surface Mount Photonic Packaging
Abstract
Co-packaged optics in next-generation datacenters require the assembly of multiple components on the same multichip module (MCM) and interconnection with hundreds of optical fibers. A novel photonic packaging substrate is required to leverage high-throughput electronic assembly with high precision optical alignment. This report highlights the results of glass substrate optimization to include optical waveguides, a fiber connector, and chip...
Paper Details
Title
Glass Substrate With Integrated Waveguides for Surface Mount Photonic Packaging
Published Date
Oct 23, 2020
Volume
39
Issue
4
Pages
912 - 919
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