information about Flip chip field
Field Hierarchy
Parent | |||
---|---|---|---|
Substrate (printing) 0 papers | Chemistry 29.4M papers | Materials science 18.9M papers | Organic chemistry 13.1M papers |
Composite material 8.8M papers | Nanotechnology 4.2M papers | Layer (electronics) 1.4M papers | Adhesive 147k papers |
Current | |||
Flip chip 11.5k papers | |||
Child | |||
Thermal copper pillar bump 1,221 papers |
Trends
Notes
History