3D integration technologies for MEMS
Published: Oct 1, 2016
Abstract
This paper describes selected technologies for the 3D integration of MEMS devices. This comprises a Via Last approach for the formation of MEMS TSVs and a Cu based thermo-compression bonding method for the realization of small 3D-WLP devices. Moreover, the Aerosol Jet technique is discussed as method for the final assembly by means of printing conducting lines over 3D...
Paper Details
Title
3D integration technologies for MEMS
Published Date
Oct 1, 2016
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