Resonance ultrasonic vibrations for crack detection in photovoltaic silicon wafers
Abstract
The resonance ultrasonic vibrations (RUV) technique is adapted for non-destructive crack detection in full-size silicon wafers for solar cells. The RUV methodology relies on deviation of the frequency response curve of a wafer, ultrasonically stimulated via vacuum coupled piezoelectric transducer, with a periphery crack versus regular non-cracked wafers as detected by a periphery mounted acoustic probe. Crack detection is illustrated on a set of...
Paper Details
Title
Resonance ultrasonic vibrations for crack detection in photovoltaic silicon wafers
Published Date
Feb 5, 2007
Volume
18
Issue
3
Pages
852 - 858
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