Electrical engineering

Soldering

Mechanical engineering

Die (integrated circuit)

Integrated circuit packaging

Layer (electronics)

Flip chip

Contact resistance

Chip

Materials science

Engineering

Wire bonding

Composite material

Adhesive

The success of nearly every multichip electronic system depends on the availability of functional, reliable chips. As chip counts in a multichip system increase, this dependency is critical. In most cases, "known good" die (KGD) are not readily available in an unpackaged form. This was a prime consideration in MCC's. Flip Chip Development Project. As part of this project, MCC was chartered with developing a method for high speed test and dynamic burn-in of single, bare IC chips. The method developed can be implemented by bare die users using "off-the-shelf" technology. It can also be implemented by bare chip suppliers without modification to the existing fabrication processes. The heart of this process is a TAB tape-based carrier. TAB tape is used to contact the chip bond pads (without actual metallurgical bonding) at about 10 grams per lead contact force. The chip is clamped to the TAB leads, and held in place so that the tape site (in its JEDEC-standard slide carrier) can be transported, tested, and burned-...

Implementing a Tab Tape-based Known Good Die Method