information about Thermal copper pillar bump field
Field Hierarchy
| Parent | |||
|---|---|---|---|
Chemistry 29.5M papers | Materials science 19M papers | Organic chemistry 13.2M papers | Composite material 8.9M papers |
Nanotechnology 4.3M papers | Layer (electronics) 1.4M papers | Adhesive 148k papers | Flip chip 11.5k papers |
| Current | |||
Thermal copper pillar bump 1,222 papers | |||
| Child | |||
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