information about Thermal copper pillar bump field

Thermal copper pillar bump

https://www.wikidata.org/wiki/Q7783038
Field Hierarchy
Parent
Chemistry
28.4M papers
Materials science
18.2M papers
Organic chemistry
12.8M papers
Composite material
8.6M papers
Nanotechnology
4.2M papers
Layer (electronics)
1.4M papers
Adhesive
143k papers
Flip chip
11.1k papers
Current
Thermal copper pillar bump
1,156 papers
Child
Trends