information about Wafer bonding field
Field Hierarchy
Parent | |||
---|---|---|---|
Physics 33.6M papers | Chemistry 29.4M papers | Engineering 25.6M papers | Materials science 19M papers |
Organic chemistry 13.1M papers | Metallurgy 5M papers | Electrical engineering 4.9M papers | Nanotechnology 4.2M papers |
Optoelectronics 3.8M papers | Silicon 532k papers | ||
Current | |||
Wafer bonding 6,023 papers | |||
Child | |||
Glass frit bonding 0 papers | Plasma-activated bonding 0 papers | Smart Cut 0 papers |
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