Adhesion layer-free attachment of gold on silicon wafer and its application in localized surface plasmon resonance-based biosensing

Volume: 312, Pages: 112155 - 112155
Published: Sep 1, 2020
Abstract
The use of a metallic adhesion layer between plasmonic-active nanostructures and a solid support is known to dampen the plasmonic response. To overcome this problem, organic adhesion layers have been introduced, which in turn can undermine the stability of the film. Moreover, both types of layers limit the regeneration of the nanostructures for multiple uses. Here we report a quick and simple approach to prepare intermediate adhesion layer-free...
Paper Details
Title
Adhesion layer-free attachment of gold on silicon wafer and its application in localized surface plasmon resonance-based biosensing
Published Date
Sep 1, 2020
Volume
312
Pages
112155 - 112155
Citation AnalysisPro
  • Scinapse’s Top 10 Citation Journals & Affiliations graph reveals the quality and authenticity of citations received by a paper.
  • Discover whether citations have been inflated due to self-citations, or if citations include institutional bias.