An anti-leakage liquid metal thermal interface material

Volume: 10, Issue: 32, Pages: 18824 - 18829
Published: Jan 1, 2020
Abstract
Liquid metals (LMs) offer extremely low thermal resistance, and have been studied as an emerging thermal interface material (TIM). In this work, we propose an improved form of LM/indium film/LM sandwich pad as an efficient TIM. The sandwich-like structure was designed to avoid liquid leakage and oxidation of LM, and additional micropillar arrays were fabricated on the surface, which benefitted the improved wetting of the substrate surface. A...
Paper Details
Title
An anti-leakage liquid metal thermal interface material
Published Date
Jan 1, 2020
Volume
10
Issue
32
Pages
18824 - 18829
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