Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment

In the chemical mechanical polishing (CMP) process of barrier layer of multilayer copper wiring in integrated circuits, it is necessary to add appropriate corrosion inhibitor into the polishing slurry to protect copper from corrosion, reduce the height difference with the barrier material and achieve high planarization. There are few literatures about the behavior of inhibitors on metal surface in CMP studied by computational chemistry. In this...