Test beam characterization of irradiated 3D pixel sensors
Abstract
Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requirements on the radiation hardness of the CMS detector Inner Tracker. Sensors based on 3D pixel technology, with its superior radiation tolerance, comply with these extreme conditions. A full study and characterization of pixelated 3D sensors fabricated by FBK is presented here. The sensors were bump-bonded to RD53A readout chips and measured at several...
Paper Details
Title
Test beam characterization of irradiated 3D pixel sensors
Published Date
Mar 10, 2020
Journal
Volume
15
Issue
03
Pages
C03017 - C03017
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