Improving Quality of Material by Reducing Its Interaction with Fused Silica Container During Processing

During the processing of electronic and optical materials at elevated temperature, the sample has the tendency to interact with the fused silica container and form chemical bonding, the so‐called “wetting”, which makes the surface section of the sample attaching to the ampoule wall. When the sample is cooled down to room temperature after the processing, as the bulk of the sample goes through thermal contraction, the wetting area remains...