Strong adhesion of polyvinylpyrrolidone-coated copper nanoparticles on various substrates fabricated from well-dispersed copper nanoparticle inks
Volume: 591, Pages: 124567 - 124567
Published: Apr 1, 2020
Abstract
In this study, we obtained copper nanoparticle (Cu NP) films exhibiting low resistivity and strong adhesion with respect to various substrates by drop-casting the Cu NP ink with polyvinylpyrrolidone (PVP) after being sintered at 250 °C. PVP functioned as a dispersant in the ink and as an adhesive at the interfaces between the Cu NPs and the substrates. Aggregation of the Cu NPs in the ink resulted in the creation of a porous NP film after...
Paper Details
Title
Strong adhesion of polyvinylpyrrolidone-coated copper nanoparticles on various substrates fabricated from well-dispersed copper nanoparticle inks
Published Date
Apr 1, 2020
Volume
591
Pages
124567 - 124567
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