Barrier/seed system for electroless metallization on complex surfaces using (aminomethylaminoethyl)phenethyltrimethoxysilane self-assembled films

Volume: 41, Issue: 4
Published: Jul 1, 2023
Abstract
High frequency signals propagate along the edges of conductors. If the conductors are electroplated, then a conducting seed layer is needed at least on one edge, so care must be taken to ensure the electrical quality of these layers. A poor, high resistance seed layer may carry all the current at 10 GHz due to reduced skin depth. In this work, we study the initial quality of self-assembled monolayer (SAM)-based seed layers that are compatible...
Paper Details
Title
Barrier/seed system for electroless metallization on complex surfaces using (aminomethylaminoethyl)phenethyltrimethoxysilane self-assembled films
Published Date
Jul 1, 2023
Volume
41
Issue
4
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