Effects of inorganic filler on performance and cost effectiveness of a soybean‐based adhesive

A modified soybean‐based adhesive with improved bonding properties and technological applicability but reduced cost was developed based on the effects of inorganic fillers on the performance of a defatted soybean meal flour (DSF) adhesive. Investigations with Fourier transform infrared spectroscopy, X‐ray diffraction measurement, thermogravimetric analysis, scanning electron microscopy, rheology tests, zeta potential analysis, and plywood...