Thickness and Resistivities of Cu/Ni Film Resulted by Electroplating on the Various Electrolyte Temperature

Volume: 1373, Issue: 1, Pages: 012029 - 012029
Published: Nov 1, 2019
Abstract
Synthesis of Cu/Ni thin films has been carried out by electroplating method assisted by magnetic fields at variations in the temperature of the solution. The use of magnetic fields in the deposition process is to accelerate mass transport, reduce the reaction effect of hydrogen evolution, improve surface morphology. An increase in the temperature of the solution can accelerate the rate of Ni ions from the anode to the cathode. The electroplating...
Paper Details
Title
Thickness and Resistivities of Cu/Ni Film Resulted by Electroplating on the Various Electrolyte Temperature
Published Date
Nov 1, 2019
Volume
1373
Issue
1
Pages
012029 - 012029
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