Structural decomposition of technological domain using patent co-classification and classification hierarchy
Abstract
This paper proposes a new method for decomposing a technological domain (TD). Specifically, the method identifies sub-TDs at the different levels of technological hierarchy within the TD based on the characteristics of patent co-classification and classification hierarchy. We defined the smallest class, named Minimum Overlapped Class (MOC), constructed by overlaps of sub-group IPC(s) and sub-class UPC(s), and sub-TD is basically identified as a...
Paper Details
Title
Structural decomposition of technological domain using patent co-classification and classification hierarchy
Published Date
Sep 13, 2019
Journal
Volume
121
Issue
2
Pages
633 - 652
Citation AnalysisPro
You’ll need to upgrade your plan to Pro
Looking to understand the true influence of a researcher’s work across journals & affiliations?
- Scinapse’s Top 10 Citation Journals & Affiliations graph reveals the quality and authenticity of citations received by a paper.
- Discover whether citations have been inflated due to self-citations, or if citations include institutional bias.
Notes
History