Structure and properties of Ta/Al/Ta and Ti/Al/Ti/Au multilayer metal stacks formed as ohmic contacts on n-GaN

Volume: 30, Issue: 19, Pages: 18144 - 18152
Published: Sep 11, 2019
Abstract
Formation of ohmic contacts to GaN is of high practical importance for device fabrication. Due to the wide band gap, formation of multilayer metal structures is required to make electrical connections with low contact resistance. The paper presents a study on structure, composition, adhesion and electrical properties of Ti/Al/Ti/Au and Ta/Al/Ta metal stacks fabricated by e-beam evaporation and thermal annealing in order to provide ohmic contacts...
Paper Details
Title
Structure and properties of Ta/Al/Ta and Ti/Al/Ti/Au multilayer metal stacks formed as ohmic contacts on n-GaN
Published Date
Sep 11, 2019
Volume
30
Issue
19
Pages
18144 - 18152
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