Overcoming institutional voids as a pathway to becoming ambidextrous: The case of China's Sichuan Telecom

Volume: 52, Issue: 4, Pages: 101871 - 101871
Published: Aug 1, 2019
Abstract
The paper examines how firms develop supply chain financing model to help overcome institutional voids (IVs) and become ambidextrous. This study presents a case analysis of a novel supply chain financing model instigated and implemented by China's Sichuan Telecom (ST) to help supply chain partners overcome IVs in their environments. We identified three unique stages in the evolution of the supply chain ambidextrous financing model: drivers for...
Paper Details
Title
Overcoming institutional voids as a pathway to becoming ambidextrous: The case of China's Sichuan Telecom
Published Date
Aug 1, 2019
Volume
52
Issue
4
Pages
101871 - 101871
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