Metal-bonding-based hermetic wafer-level MEMS packaging technology using in-plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough

Volume: 206, Issue: 2, Pages: 44 - 53
Published: Jan 1, 2019
Abstract
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Paper Details
Title
Metal-bonding-based hermetic wafer-level MEMS packaging technology using in-plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough
Published Date
Jan 1, 2019
Volume
206
Issue
2
Pages
44 - 53
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