Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints

Cu sintering is one of the emerging technologies in the field of micro- and power electronics where operating temperatures higher than 150°C are required. At these temperatures, solder joints reach their limits due to high homologous temperatures. Hence, Cu sintered joints can serve as a substitute for these soft solder joints, being advantageous also with respect to thermo-dynamic stability, fatigue resistance, electrical conductance and cost....