Temporary wafer bonding - key technology for MEMS devices

Back thinning after temporary wafer bonding is a key technology for three dimensional (3D) integration of sensors and electronic components to obtain miniaturized systems. Ultrathin silicon wafers are difficult to handle therefore various temporary bonding approaches have been developed to temporarily stabilize and protect them during the subsequent fabrication steps. We have characterized two of these methods: The BrewerBOND® with a mechanical...