Silicon-on-Insulator Substrates as a Micromachining Platform for Advanced Terahertz Circuits

Volume: 105, Issue: 6, Pages: 1105 - 1120
Published: Jun 1, 2017
Abstract
This paper presents a comprehensive overview of the development and utilization of a micromachined silicon-on-insulator (SOI) fabrication process that has enabled the development of terahertz (THz) frequency superconducting-insulator-superconducting (SIS) and hot-electron bolometer (HEB) mixers, broadband directional couplers, on-wafer probes, as well as several multipliers. Through the detailed presentation of these circuits, it is demonstrated...
Paper Details
Title
Silicon-on-Insulator Substrates as a Micromachining Platform for Advanced Terahertz Circuits
Published Date
Jun 1, 2017
Volume
105
Issue
6
Pages
1105 - 1120
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