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Reliability Concerns Associated with PV Technologies

Published on Jan 1, 2010
Nick Bosco10
Estimated H-index: 10
(NREL: National Renewable Energy Laboratory)
Abstract
1.0 Wafer Silicon 1.1 Cracked cells (bonding processes, strain, etc.) [1-4] 1.2 Solder joint or gridline interface failure (increased series resistance) [5] 1.3 Reduced adhesion leading to corrosion and/ or delamination [6, 7] 1.4 Slow degradation of ISC [8] 1.5 Fatigue of ribbon interconnect 1.6 Junction box failure (poor solder joints, arcing, etc.) [9] 1.7 Busbar adhesion degradation, electrical contact, etc. 1.8 Glass edge damage of frameless modules (though installation, handling, etc.) 1.9 Light-induced cell degradation 1.10 Effect of glass on encapsulant performance [10-13] 1.11 Front surface soiling [14] 1.12 Mechanical failure of glass-glass laminates [14] 1.13 General issues [section 7.0]
  • References (41)
  • Citations (18)
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References41
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