Review paper
The effect of cell thickness on module reliability
Published: May 1, 2008
Abstract
This paper addresses the issue of the reliability of modules using ultra-thin crystalline silicon cells. Do thin cells have a greater likelihood of cracking during production, transport, installation or use and if so does this result in long term degradation of the power? The present qualification test sequence, IEC 61215 does not adequately address this issue, The only mechanical test in IEC 61215 is a static mechanical load test consisting of...
Paper Details
Title
The effect of cell thickness on module reliability
Published Date
May 1, 2008
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