Original paper
Embedded wafer level ball grid array (eWLB) technology for millimeter-wave applications
Published: Dec 1, 2011
Abstract
The embedded wafer level ball grid array (eWLB) is a novel packaging technology that shows excellent performance for millimeter-wave (mm-wave) applications. We present simulation and measurement results of single-ended and differential transmission lines realized using the thin-film redistribution layers (RDL) of an eWLB. We demonstrate the capabilities for the integration of passives on example of a configurable 17/18 GHz down-converter circuit...
Paper Details
Title
Embedded wafer level ball grid array (eWLB) technology for millimeter-wave applications
Published Date
Dec 1, 2011
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History