Mario Baum
Fraunhofer Society
Composite materialMaterials scienceElectronic engineeringWafer bondingMicroelectromechanical systems
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Publications 44
Jul 23, 2019 in EMBC (International Conference of the IEEE Engineering in Medicine and Biology Society)
#1Özgü Dogan (Fraunhofer Society)H-Index: 1
#2N. Schierbaum (Fraunhofer Society)
Last. K. Seidl (University of Duisburg-Essen)
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t a novel miniaturized multi sensor implant for monitoring hemodynamic parameters in cardiovascular regions. Pressure measurements are performed with a highly accurate capacitive pressure sensor. An additional acceleration and temperature sensor allows compensating the impact of patient’s inclination and temperature variations on the pressure measurement, respectively. A multi-functional transponder application-specific integrated circuit (ASIC) manages sensor signal processing, storage of ID, s...
#1Sebastian WinklerH-Index: 3
#2Jan EdelmannH-Index: 5
Last. Andreas SchubertH-Index: 18
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Hermetic and mechanically strong glass-to-metal seals are required for many applications in technological fields such as aerospace engineering or medical engineering. While traditional glass-to-metal bonding technologies require melting of the glass, modern technologies such as anodic bonding use glass in its solid state. In this publication, a novel glass-to-metal bonding method with process temperatures around the softening point of the glass material is investigated. A glass window (silica ba...
#1Uwe Zschenderlein (Chemnitz University of Technology)H-Index: 4
#2Markus Klingler (Bosch)H-Index: 4
Last. Bernhard Wunderle (Chemnitz University of Technology)H-Index: 18
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The increased attention for sintered silver as die attach attracts also interest in its reliability assessment. Since the porous joint material shows rate-dependent behaviour at elevated temperature, its visco-plastic behaviour needs to be quantified. Though tensile tests are frequently used for that task is still a challenge to manufacture homogeneous specimens large enough to be safely handled and tensile tested. In this paper the we have presented a comprehensive technology for manufacturing ...
#1Mario BaumH-Index: 6
#2Nooshin SaeidiH-Index: 1
Last. Thomas OttoH-Index: 10
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In this paper, we present the design, modeling, fabrication and initial wafer level characterization of Capacitive Micromachined Ultrasound Transducers (CMUTs) with target operating frequencies suitable for medical imaging and therapy. Using finite element analysis, a multilayer stack of thin film materials for the hexagonal shaped cell membrane was studied. An optimized stack in terms of membrane stress and cell size was selected for device fabrication based on a wafer bonding approach. The mod...
1 CitationsSource
#1Akhil Kumar (Chemnitz University of Technology)H-Index: 1
#2Uwe Zschenderlein (Chemnitz University of Technology)H-Index: 4
Last. Bernhard Wunderle (Chemnitz University of Technology)H-Index: 18
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Cu sintering is one of the emerging technologies in the field of micro- and power electronics where operating temperatures higher than 150°C are required. At these temperatures, solder joints reach their limits due to high homologous temperatures. Hence, Cu sintered joints can serve as a substitute for these soft solder joints, being advantageous also with respect to thermo-dynamic stability, fatigue resistance, electrical conductance and cost. This paper addresses failure analysis of sintered (...
#1Franz Selbmann (Fraunhofer Society)H-Index: 1
#2Mario Baum (Fraunhofer Society)H-Index: 6
Last. Thomas Otto (Chemnitz University of Technology)H-Index: 10
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A necessary coating for so called double layer isolation for electronic boards in space applications is presented within this paper. A Parylene F layer with a certain thickness shall realize the second electrical isolation according to the double isolation requirements of the research project. Parylene encapsulation and isolation is one approach to improve the performance and functionalities of electronic and micro systems. By using such kind of innovative and outstanding materials new applicati...
#1Dirk WuenschH-Index: 1
Last. Thomas OttoH-Index: 10
view all 9 authors...
#1Mario Baum (Fraunhofer Society)H-Index: 6
#2Dirk Wuensch (Fraunhofer Society)H-Index: 1
Last. Thomas Otto (Fraunhofer Society)H-Index: 10
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This paper presents an overall system for hemodynamic controlling consisting of a transmitter / reader, which operates outside the human body, and an implantable sensor unit. The implantable sensor module detects pressure, acceleration, temperature, voltage, and impedance. In order to achieve the required miniaturization, the acceleration sensor was developed in a MEMS (micro electro mechanical system) technology. Except the MEMS pressure sensor and accelerometer the other sensory functions are ...
1 Citations
#1Dirk Wuensch (Fraunhofer Society)H-Index: 1
#2Lina Purwin (Fraunhofer Society)
Last. Thomas Otto (Fraunhofer Society)H-Index: 10
view all 9 authors...
Back thinning after temporary wafer bonding is a key technology for three dimensional (3D) integration of sensors and electronic components to obtain miniaturized systems. Ultrathin silicon wafers are difficult to handle therefore various temporary bonding approaches have been developed to temporarily stabilize and protect them during the subsequent fabrication steps. We have characterized two of these methods: The BrewerBOND® with a mechanical release and ZoneBOND® with a combined chemical/mech...