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Chunhu Zhang
University of Virginia
16Publications
7H-index
166Citations
Publications 16
Newest
Jun 1, 2019 in IMS (International Microwave Symposium)
#1Chunhu Zhang (UVA: University of Virginia)H-Index: 7
#2Matthew F. BauwensH-Index: 7
Last.Robert M. Weikle (UVA: University of Virginia)H-Index: 23
view all 7 authors...
This paper demonstrates the first differential on-wafer probe with integrated balun operating in the WR-3.4 (220 – 330 GHz) waveguide band. The probe employs integrated balun circuitry to convert the single-ended signal from the waveguide output of a VNA into differential stimuli at the on-wafer transmission line output. The design approach, fabrication method, and measured results are described in this paper.
Source
Jun 1, 2017 in IMS (International Microwave Symposium)
#1Chunhu Zhang (UVA: University of Virginia)H-Index: 7
#2Matthew F. BauwensH-Index: 7
Last.Arthur W. Lichtenberger (UVA: University of Virginia)H-Index: 7
view all 7 authors...
This paper describes the first-reported development of a micromachined differential probe for direct on-wafer measurements operating in the WM-1295 (140–220 GHz) frequency band. Design and fabrication of the probe, which includes integrated circuitry for converting the input of a single-ended vector network analyzer to differential mode, are described and an on-wafer calibration procedure for extracting the probe mixed-mode scattering parameters. is detailed.
Source
#1Chunhu Zhang (UVA: University of Virginia)H-Index: 7
#2Matthew F. Bauwens (UVA: University of Virginia)H-Index: 7
Last.Arthur W. Lichtenberger (UVA: University of Virginia)H-Index: 7
view all 5 authors...
Differential circuits are commonly used for millimeter-wave monolithic integrated circuits such as amplifiers and voltage-controlled oscillators. The infrastructure for their characterization, however, remains limited at these frequencies. With the recent development in micromachined on-wafer probes, a probe integrated with balun circuitry can provide a convenient way to characterize differential integrated circuits. In this paper, a micromachined probe with an integrated balun operating at W-ba...
7 CitationsSource
#1Benjamin D. Gonzalez (UVA: University of Virginia)
#2Matthew F. Bauwens (UVA: University of Virginia)H-Index: 7
Last.Robert M. Weikle (UVA: University of Virginia)H-Index: 23
view all 6 authors...
Source
#1Robert M. WeikleH-Index: 23
#2Chunhu ZhangH-Index: 7
view all 7 authors...
Due to the technological needs of the radio astronomy and remote sensing scientific communities, as well as emerging applications in the areas of imaging, security, and broadband communications, terahertz and submillimeter-wave electronics continues to be an area of growth and increasing interest for academic researchers, government laboratories, and industry. The recent establishment of a commercial infrastructure for test and measurement instrumentation in this spectral region has fueled this ...
1 CitationsSource
#1Matthew F. Bauwens (UVA: University of Virginia)H-Index: 7
#2Lihan Chen (UVA: University of Virginia)H-Index: 7
Last.Robert M. Weikle (UVA: University of Virginia)H-Index: 23
view all 8 authors...
A micromachined on-wafer probe has been designed to facilitate the development of integrated circuits in the 600-900 GHz frequency range. The probe tip is fabricated on a 5-micrometer thick high-resistivity silicon substrate using a silicon-on- insulator fabrication process. This letter updates previous work on WR-1.2 wafer probes and presents for the first time the full RF characterization of the probe. These are the first reported on-wafer measurements above 750 GHz.
5 CitationsSource
Jun 1, 2014 in IMS (International Microwave Symposium)
#1Chunhu Zhang (UVA: University of Virginia)H-Index: 7
#2Matthew F. Bauwens (UVA: University of Virginia)H-Index: 7
Last.Arthur W. Lichtenberger (UVA: University of Virginia)H-Index: 7
view all 5 authors...
There has been a growing interest in developing differential Millimeter-wave Monolithic Integrated Circuits (MMICs) in recent years. The characterization infrastructure for these differential devices however, is still limited at higher frequencies. In this paper, a balun integrated probe is designed to cover the entire W-band (75 - 110 GHz) with the potential to be scaled to even higher frequencies. Test structures of the balun are characterized and found to agree well with simulated results for...
10 CitationsSource
#1Qiang Yu (UVA: University of Virginia)H-Index: 3
#2Matthew F. Bauwens (UVA: University of Virginia)H-Index: 7
Last.N. Scott Barker (UVA: University of Virginia)H-Index: 11
view all 6 authors...
This paper introduces an improved method for monitoring and controlling the contact condition of terahertz on-wafer probes to enhance the measurement repeatability as well as probe lifetime. This method enables accurate contact force and contact angle measurements without modification to the standard probe station. Both probe contact force and contact angle are crucial for RF measurement repeatability. Repeatable probe contact force can be achieved by properly monitoring and controlling the stra...
12 CitationsSource
#1Qiang Yu (UVA: University of Virginia)H-Index: 3
#2Matthew F. Bauwens (UVA: University of Virginia)H-Index: 7
Last.N. Scott Barker (UVA: University of Virginia)H-Index: 11
view all 6 authors...
This paper introduces an improved method for monitoring and controlling the contact condition of terahertz on-wafer probes. This method enables accurate contact force measurement without modification to the standard probe station. Repeatable probe contact force is crucial for RF measurement repeatability and can be achieved by properly monitoring and controlling the strain generated at designated positions on the terahertz probe due to probe deformation induced by contacting the test substrate. ...
3 CitationsSource
#1Matthew F. Bauwens (UVA: University of Virginia)H-Index: 7
#2Lihan Chen (UVA: University of Virginia)H-Index: 7
Last.Robert M. Weikle (UVA: University of Virginia)H-Index: 23
view all 7 authors...
A micromachined on-wafer probe designed for WR-1.2 rectangular waveguide is demonstrated in this paper to further enable submillimeter-wave integrated circuits testing. Initial measurements of a prototype WR-1.2 micromachined on-wafer probe exhibit an insertion loss better than 9 dB for the lower half of the WR-1.2 band.
7 Citations
12